A new paradigm in Wafer Level manufacturing: FlexLineTM
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چکیده
FlexLineTM is an innovative manufacturing approach that provides freedom from wafer diameter constraints, while enabling supply chain simplification and significant cost reductions not possible with a conventional manufacturing flow. This breakthrough approach delivers unprecedented flexibility in producing both fan-out wafer level packages (FOWLP) and fan-in wafer level chip scale packages (WLCSP) on the same manufacturing line.
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